Automated Industrial AFM for High-Resolution 3D Metrology

The XE-3DM provides the unique advantage of a non-destructive in-line imaging tool capable of providing a) high resolution, b) direct, and c) repeatable measurements with complete three dimensional information for lines, trenches, and multilayer 3D devices.

Park Systems provides a reference metrology system for the critical dimension and sidewall analysis. As a fully automated AFM system, the 3DM allows for sidewall, undercut, and line/trench width characterization. With our True Non-Contact ModeTM, our XE-3DM is capable of imaging the most challenging structures such as soft photoresists and 3D multilayer topologies.

As the dimensions of device structures continue to decrease and newer 3D structures emerge, the methods for critical dimension metrology are no longer adequate to characterize process variables. For the traditional techniques such as CD-SEM, OCD, and FIB/SEM, the limitations are becoming more apparent. For example, due to the sidewall roughness, the CD-SEM does not provide a clear definition at the structure edge, the OCD only provides an average value of the critical dimension, and the FIB/SEM provides only a single point measurement and does not provide a complete picture of the structure dimensions.

High Resolution Access to Undercut and Sidewall
  • Unique decoupled XY and Z scanning system with tilted Z scanner
  • Z-scanner is tilted sideways from -19 to +19 degrees and -38 to +38 degrees
  • Use of normal high aspect ratio tips for high resolution imaging
  • XY scan of up to 100 μm x 100 μm
  • Up to 25 μm Z scan range by high force scanner

Complete 3D Metrology of Sidewall
  • Sidewall roughness measurement
  • Accurate angle measurement of sidewalls
  • Critical dimension measurements of vertical sidewalls

Non-destructive CD and Sidewall Measurements by True Non-Contact Mode^TM
  • In-line measurement of the smallest features in the industry
  • Non-destructive measurement of soft photoresist
  • Less tip wear for prolonged high-quality and high-resolution imaging
  • Immunity from parameter-dependent results observed in tapping imaging

High-Throughput Inline Automation
  • Automatic measurement and analysis of trenches, overhangs, and undercuts
  • Cleanroom compatibility and remote control interface
  • Automatic tip exchange (optional)
  • Equipment Front End Module (EFEM) for wafer handling (optional)

Nanotechnology Solutions Partner
  • Partnering with customers to meet the fast changing requirements
  • Flexible software and hardware modifications to the modular platform
  • Enable rapid response to customers' needs