Artifact Free Metrology by Crosstalk Elimination
  • Unique decoupled XY scanning system provides a flat scanning stage
  • Flat and linear XY scan removes artifacts from background curvature
  • Accurate feature measurements with industry leading gauge statistics
  • Superior tool to tool matching

Superior Accuracy and Longer Tip Life by True Non-Contact Mode^TM
  • Less tip wear for prolonged high-quality and high-resolution imaging
  • Immunity from parameter-dependent results observed in tapping imaging
  • 10 times or longer tip life for general purpose & defect imaging

Precision Nanometrology Measurements
  • Surface roughness measurement below 1Å RMS roughness
  • Provides the precision angle measurement accuracy of less than 0.1 degrees
  • Low noise floor enables surface flatness measurements for long range CMP metrology

High-Throughput Inline Automation
  • Automatic data acquisition and analysis of angles, roughness, and trench features
  • Cleanroom compatibility and remote control interface
  • Automatic tip exchange (optional)
  • Equipment Front End Module (EFEM) for automatic wafer handling (optional)
  • Long range traveling stage for CMP profiling (optional)

Nanotechnology Solutions Partner
  • Trusted partnership with customers to meet the fast changing requirements
  • Application specific solutions that maximize throughput
  • Modular software and hardware platform enable rapid response