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XE-3DM

Main Application

	Sidewall Roughness (SWR)	Critical Angle Measurement
	Sidewall Angle (SWA)	Critical Dimension (CD) Measurement
	Line Width Roughness (LWR)	Wafer Inspection (Roughness/Height/Width)
	Line Edge Roughness (LER)	Surface Roughness Measurement
	Undercut/Overhang Characterization	Trench Characterization
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