Automated Industrial AFM for In-line Wafer Inspection and Metrology
Park Systems introduces the industry’s lowest-noise, fully automated industrial AFM, the XE-Wafer. The automated AFM system is designed for high resolution surface roughness, trench width, depth and angle measurements on 200 mm & 300 mm wafers with sub-nanometer precision in a 24/7 production environment. Our True Non-Contact Mode™ enables non-destructive measurements even on soft structures such as photoresist trench surfaces.
Process engineers in the hard disk and semiconductor industries currently use costly FIB/SEM instrumentation to acquire roughness, side-wall angle, and height measurements in nanoscale dimensions. Unfortunately, FIB/SEM is destructive, slow, and has a high cost per measurement.
The XE-Wafer is a fully automated industrial AFM that can acquire surface roughness, depth, and angle measurements on 200 mm & 300 mm wafers with speed, precision, and value in a production environment.
The XE-Wafer offers a non-destructive, in-line imaging tool capable of providing high resolution, direct, and repeatable measurements on multiple locations without damaging the sample. The increased precision and ability to monitor line-width roughness will allow process engineers to produce devices with higher performance, at a significantly lower cost than FIB/SEM.