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  • Park
    Wafer Series
    AFM Specifications
  • NX-Wafer
  • XE-Wafer
 

Park NX-Wafer Specifications

System
Specification

Motorized XY stage

200mm : travels up to 275 mm × 200 mm, 0.5 µm resolution

300mm : travels up to 400 mm × 300 mm, 0.5 µm resolution, 1 µm repeatability


Motorized Z stage

27 mm Z travel distance,
0.08 µm resolution, < 1 µm repeatability

Motorized Focus Stage

9 mm Z travel distance for on-axis optics


Sample Thickness Allowance

up to 20 mm


Full scan range Z run-out

< 2 nm, repeatability < 1nm


COGNEX Pattern Recognition

pattern align resolution of 1/4 pixel

 

Scanner Performances

XY Scanner

100 µm × 100 µm (Large mode)
50 µm × 50 µm (Medium mode)
10 µm × 10 µm (Small mode)
Single-module flexure XY scanner with closed-loop control


XY Scanner Resolution

0.28 nm (Large mode)
0.03 nm (Small mode)

Z Scanner Range

15 µm (Large mode)
2 µm (Small mode)

Z Scanner Resolution

0.016 nm (Large mode)
0.002 nm (Small mode)

Z Scanner Detector Noise

0.02 nm @ 1kHz

 

AFM and XY Stage
Control Electronics

ADC

18 channels
4 high-speed ADC channels (64 MSPS)
24-bit ADCs for X,Y and Z scanner position sensor

 

DAC

12 channels
2 high-speed DAC channels (64 MSPS)
20-bit DACs for X,Y and Z scanner positioning

 

Compliances

CE

SEMI Standard S2/S8

 

Vibration, Acoustic Noise, and ESD Performances

Floor Vibration

< 0.5 µm/s (10 Hz to 200 Hz w/ Active Vibration Isolation System)

Acoustic Noise

>20 dB attenuation w/ Acoustic Enclosure

 

Facility Requirements

Room Temperature (Stand By)

10 °C ~ 40 °C 


Room Temperature (Operating)

18 °C ~ 24 °C


Humidity

30% to 60% (not condensing)


Floor Vibration Level

VC-E (3 µm/sec)


Acoustic Noise

Below 65 dB

Pneumatics

Vacuum : -80 kPa
CDA (or N2): 0.7 MPa


Power Supply Rating

208V - 240 V, single phase, 15 A (max)


Total Power Consumption

2 KW (typical)


Ground Resistance

Below 100 ohms

 

Dimensions & Weight

200 mm System

1500 mm(w) × 980 mm(d) x 2050 mm(h)
w/o EFEM, 1020 kg approx. (incl. Control Cabinet)

2465 mm(w) × 1000 mm(d) x 2050 mm(h)
w/ EFEM, 1230 kg approx. (incl. Control Cabinet)


Ceiling Height

2500 mm or more


Operator Working Space

3300 mm (w) x 2300 mm (d), Minimum

300 mm System

1840 mm(w) × 1170 mm(d) x 2050 mm(h)
w/o EFEM, 1320 kg approx. (incl. Control Cabinet)

3260 mm(w) × 1350 mm(d) x 2050 mm(h)
w/ EFEM, 2120 kg approx. (incl. Control Cabinet)


Ceiling Height

2500 mm or more


Operator Working Space

4540 mm (w) x 2850 mm (d), Minimum

 
footprint-300mm-wafer[ Park NX-Wafer 300mm installation layout ]
 
 

Park XE-Wafer Specifications

SPECIFICATIONS

System Specification

200 mm Motorized XY stage : travels up to 275 mm × 200 mm, 0.5 μm resolution
300 mm Motorized XY stage : travels up to ~375 mm × 300 mm, 0.5 μm resolution, < 1 μm repeatability
Motorized Z stage : ~30 mm Z travel distance, ~0.08 μm resolution, < 1 μm repeatability
Motorized Focus Stage : 11 mm Z travel distance for on-axis optics
Sample Thickness Allowance : up to 20 mm
Full scan range Z run-out : < 2 nm, repeatability < 1 nm
COGNEX Pattern Recognition : pattern align resolution of 1/4 pixel

 

Scanner Performances

XY Scanner Range : 100 μm × 100 μm (large mode), 50 μm x 50 μm (medium mode), 10 μm × 10 μm (small mode)
XY Scanner Resolution : 1.5 nm (high voltage mode), < 0.2 nm (low voltage mode)
Z Scanner Range : 12 μm (high voltage mode), 1.7 μm (low voltage mode)
Z Scanner Resolution : < 0.2 nm

 

AFM and XY Stage Control Electronics

Controller Processing Unit : 600 MHz and 4800 MIPS
Signal ADC &DAC : 16-bit, 500 kHz bandwidth, internal lock-in

 

Vibration, Acoustic Noise, and ESD Performances

Floor Vibration : < 0.5 μm/s (10 Hz to 200 Hz w/ Active Vibration Isolation System)
Acoustic Noise : > 20 dB attenuation w/ Acoustic Enclosure

 

Facility Requirements

Room Temperature (Stand By) : 10 °C ~ 40 °C
Room Temperature (Operating) : 18 °C ~ 24 °C
Humidity : 30% to 60% (not condensing)
Floor Vibration Level : VC-E (3 μm/sec)
Acoustic Noise : Below 65 dB
Pneumatics: Vacuum : -80 kPa
CDA : 0.7 Mpa
Power Supply Rating : 208~240V, single phase, 15A (max)
Total Power Consumption : 2 KW (typical)
Ground Resistance : Below 100 ohms

 

Dimension & Weight

200mm System : 880 mm(w) × 1050 mm(d) × 2024 mm(h) w/o EFEM, 800 kg approx. (incl. XE-WAFER main body)
                                1820 mm(w) × 1050 mm(d) × 2024 mm(h) w/ EFEM, 1010 kg approx. (incl. XE-WAFER main body)
Control Cabinet : 800 mm(w) × 800 mm(d) × 1000 mm(h), 160 kg approx. (incl. controllers)
                                600 mm(w) x 800 mm(d) x 2000 mm(h) tower type, 220 kg approx. (incl. controllers)
System Floor Space : 1780 mm(w) × 980 mm(d) w/o EFEM
System Floor Space : 3050 mm(w) × 980 mm(d) w/ EFEM
Ceiling Height : 2000 mm or more
Operator Working Space : 3300 mm(w) x 1950 mm(d), minimum

300mm System : 1220 mm(w) × 1200 mm(d) × 2024 mm(h) w/o EFEM, 1150 kg approx. (incl. XE-WAFER main body)
                                2490 mm(w) × 1720 mm(d) × 2024 mm(h) w/ EFEM, 1450 kg approx. (incl. XE-WAFER main body)
Control Cabinet : 800 mm(w) × 800 mm(d) × 1000 mm(h), 160 kg approx. (incl. controllers)
                                600 mm(w) x 800 mm(d) x 2000 mm(h) tower type, 220 kg approx. (incl. controllers)
Wafer Handler (EFEM) : 1270 mm(w) x 1720 mm(d) x 2024 mm(h), 300 kg approx
System Floor Space : 1220 mm(w) × 1200 mm(d) w/o EFEM
System Floor Space : 2490 mm(w) × 1720 mm(d) w/ EFEM
Ceiling Height : 2000 mm or more
Operator Working Space : 4500 mm(w) x 3120 mm(d)

footprint[ Park XE-Wafer 200mm installation layout ]
 

Software & User Interface

XEA - Industrial Automation & Analysis

XEA is a system software for automation that carries out the AFM measurement of a sample following the preset procedure written in a recipe file. User-friendly XEA architecture provides flexibility to operator to perform various system-wide functions.
 
• Supports auto, semi-auto, and manual mode
• Editable measurement method for each automated procedure
• Live monitoring of the measurement process
• Automatic analysis of acquired measurement data

 

XEP – Data Acquisition

All the user controls on AFM measurements are operated through XEP, the data acquisition program. The user-oriented interface provides easy operation of AFM.
 
• Simultaneous data acquisition of up to 16 images
• Maximum 4096 × 4096 pixels image size
• Dedicated Force-distance and I-V spectroscopy with batch processing
• Cantilever spring constant calibration
• Script-level control through external program (LabVIEW, C++)

 

XEI – Image Processing and Analysis

XEI is the AFM image processing and analysis program. The powerful processing algorithms make the analysis easy and streamlined. With its most advanced and versatile imaging features, XE users can obtain essential and critical information from their experiment.
 
• Image analysis of line profile, region, 3D rendering
• Spectroscopy data analysis module (F-d, I-V)
• Directly copy/paste to presentation program
• Multiple image comparison
• Image overlay of two different images

 

Options

Long Range Profiler

Less than ±5 nm out-of-plane motion over 10 mm scan.

 

Automatic Tip Exchange (ATX)

Automatic Tip Exchange performs fully automated tip exchanges in order to seamlessly continue automated measurement routines. It automatically calibrates cantilever location and optimizes measurement settings based on measurements of a reference pattern. Our novel magnetic approach to the tip exchange yields a 99% success rate, higher than the traditional vacuum techniques.

 

Automatic Wafer Handler (EFEM or FOUP)

The XE-3DM can be further customized by adding an automatic wafer handler (EFEM or FOUP or other). The high-precision, nondestructive wafer handler robot arm fully ensures XE-3DM users to receive fast and reliable wafer measurement automation.

 

Ionization System

Ionization system effectively removes electrostatic charges. It ionizes the charged objects and is very reliable since the system always generates and maintains an ideal balance of positive and negative ions without causing any contamination to the surrounding area. It also reduces the accidental electrostatic built-in charge that may occur during sample handling.

Park Wafer - Specifications | Park Atomic Force Microscope