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  • Park
    3DM Series
    AFM Specifications
  • NX-3DM
  • XE-3DM
 

Park NX-3DM Specifications

System
Specification

Motorized XY stage

200 mm: travels up to 275 mm × 200 mm,
0.5 μm resolution

300 mm:travels up to 400 mm × 300 mm,
0.5 μm resolution, < 1 μm repeatability


Motorized Focus Stage

9 mm Z travel distance for on-axis optics


Motorized Angle Range

-19 degrees and +19 degrees
-38 degrees and +38 degrees
< 0.5 degree angle repeatability


Motorized Z Stage

27 mm Z travel distance
0.08 μm resolution
< 1 μm repeatability

Z Scanner

Z Scanner Range: 15 μm (large mode)
2 μm (small mode)

Z Scanner Resolution: 0.016 nm (large mode)
0.002 nm (small mode)

Z Scanner Noise Floor: < 0.05 nm

Z Scanner Detector Noise: 0.02 nm @ 1kHz


COGNEX Pattern Recognition

pattern align resolution of 1/4 pixel

 

Scanner Performances

XY Scanner

Single-module flexure XY scanner with closed-loop control
100 µm × 100 µm (Large mode)
50 µm × 50 µm (Medium mode)
10 µm × 10 µm (Small mode)

XY Scanner Resolution

0.28 nm (Large mode)
0.03 nm (Small mode)

 

Facility Requirements

Room Temperature (Stand By)

10 °C ~ 40 °C 


Room Temperature (Operating)

18 °C ~ 24 °C


Humidity

30% to 60% (not condensing)


Floor Vibration Level

VC-E (3 µm/sec)


Acoustic Noise

Below 65 dB

Pneumatics

Vacuum : -80 kPa
CDA (or N2): 0.7 MPa


Power Supply Rating

208V - 240 V, single phase, 15 A (max)


Total Power Consumption

2 KW (typical)


Ground Resistance

Below 100 ohms

 

Dimensions & Weight

200 mm System

1500 mm(w) × 980 mm(d) x 2050 mm(h)
w/o EFEM, 1020 kg approx. (incl. Control Cabinet)

2465 mm(w) × 1000 mm(d) x 2050 mm(h)
w/ EFEM, 1230 kg approx. (incl. Control Cabinet)


Ceiling Height

2500 mm or more


Operator Working Space

3300 mm (w) x 2300 mm (d), Minimum

300 mm System

1840 mm(w) × 1170 mm(d) x 2050 mm(h)
w/o EFEM, 1320 kg approx. (incl. Control Cabinet)

3260 mm(w) × 1350 mm(d) x 2050 mm(h)
w/ EFEM, 2120 kg approx. (incl. Control Cabinet)


Ceiling Height

2500 mm or more


Operator Working Space

4540 mm (w) x 2850 mm (d), Minimum

 
footprint[ Park NX-3DM 300mm installation layout ]
 
 

Park XE-3DM Specifications

SPECIFICATIONS

System Specification

200mm Motorized XY stage : travels up to 275 mm × 200 mm, 0.5 μm resolution
300mm Motorized XY stage : travels up to ~375 mm × 300 mm, 0.5 μm resolution, < 1 μm repeatability
Motorized Z stage : ~30 mm Z travel distance, ~0.08 μm resolution, < 1 μm repeatability
Motorized Focus Stage : 11 mm Z travel distance for on-axis optics
Motorized Angle Range : -19 degree and +19 degree, -38 degree and +38 degree, < 0.5 degree angle repeatability
Sample Thickness Allowance : up to 20 mm
Full scan range Z run-out : < 2 nm, repeatability < 1 nm
COGNEX Pattern Recognition : pattern align resolution of 1/4 pixel

 

Scanner Performances

XY Scanner Range : 100 μm × 100 μm (large mode), 50 μm x 50 μm (medium mode), 10 μm × 10 μm (small mode)
XY Scanner Resolution : 1.5 nm (high voltage mode), < 0.2 nm (low voltage mode)
Z Scanner Range : 12 μm (high voltage mode), 1.7 μm (low voltage mode)
Z Scanner Resolution : < 0.2 nm 

 

AFM and XY Stage Control Electronics

Controller Processing Unit : 600 MHz and 4800 MIPS
Signal ADC & DAC : 16-bit, 500 kHz bandwidth, internal lock-in

 

Vibration, Acoustic Noise, and ESD Performances

Floor Vibration : < 0.5 μm/s (10 Hz to 200 Hz w/ Active Vibration Isolation System)
Acoustic Noise : >20 dB attenuation w/ Acoustic Enclosure

 

Facility Requirements

Room Temperature (Stand By) : 10 °C ~ 40 °C
Room Temperature (Operating) : 18 °C ~ 24 °C
Humidity : 30% to 60% (not condensing)
Floor Vibration Level : VC-E (3 μm/sec)
Acoustic Noise : Below 65 dB
Pneumatics : Vacuum : -80 kPa
CDA : 0.7 Mpa
Power Supply Rating : 208~240V, single phase, 15A (max)
Total Power Consumption : 2 KW (typical)
Ground Resistance : Below 100 ohms

 

Dimension & Weight

200mm System : 880(w) × 1050(d) × 2024(h) w/o EFEM, 800 kg approx. (incl. XE-3DM main body)
                                1820(w) × 1050(d) × 2024(h) w/ EFEM, 1010 kg approx. (incl. XE-3DM main body)
Control Cabinet : 800(w) × 800(d) × 1000(h), 160 kg approx. (incl. controllers)
                                 600(w) x 800(d) x 2000(h) tower type, 220 kg approx. (incl. controllers)
System Floor Space : 1780(w) × 980(d) w/o EFEM
System Floor Space : 3050 (w) × 980 (d) w/ EFEM
Ceiling Height : 2000 or more
Operator Working Space : 3300(w) x 1950(d), minimum (dimension unit: mm)

300mm System : 1220(w) × 1200(d) × 2024(h) w/o EFEM, 1150 kg approx. (incl. XE-3DM main body)
                                 2490(w) × 1720(d) × 2024(h) w/ EFEM, 1450 kg approx. (incl. XE-3DM main body)
Control Cabinet : 800(w) × 800(d) × 1000(h), 160 kg approx. (incl. controllers)
                                 600(w) x 800(d) x 2000(h) tower type, 220 kg approx. (incl. controllers)
Wafer Handler (EFEM) : 1270(w) x 1720(d) x 2024(h), 300 kg approx
System Floor Space : 1220(w) × 1200(d) w/o EFEM
System Floor Space : 2490 (w) × 1720 (d) w/ EFEM
Ceiling Height : 2000 or more
Operator Working Space : 4500(w) x 3120(d) (dimension unit: mm)

footprint[ Park XE-3DM 200mm installation layout ]
 

Software & User Interface

XEA - Industrial Automation & Analysis

XEA is a system software for automation that carries out the AFM measurement of a sample following the preset procedure written in a recipe file. User-friendly XEA architecture provides flexibility to operator to perform various system-wide functions.
 
• Supports auto, semi-auto, and manual mode
• Editable measurement method for each automated procedure
• Live monitoring of the measurement process
• Automatic analysis of acquired measurement data

 

XEP – Data Acquisition

All the user controls on AFM measurements are operated through XEP, the data acquisition program. The user-oriented interface provides easy operation of AFM.
 
• Simultaneous data acquisition of up to 16 images
• Maximum 4096 × 4096 image size
• Dedicated Force-distance and I-V spectroscopy with batch processing
• Cantilever spring constant calibration
• Script-level control through external program (LabVIEW, C++)

 

XEI – Image Processing and Analysis

XEI is the AFM image processing and analysis program. The powerful processing algorithms make the analysis easy and streamlined. With its most advanced and versatile imaging features, XE users can obtain essential and critical information from their experiment.
 
• Image analysis of line profile, region, 3D rendering
• Spectroscopy data analysis module (F-d, I-V)
• Directly copy/paste to presentation program
• Multiple image comparison
• Image overlay of two different images

 

Options

Automatic Tip Exchange (ATX)

Automatic Tip Exchange performs fully automated tip exchanges in order to seamlessly continue automated measurement routines. It automatically calibrates cantilever location and optimizes measurement settings based on measurements of a reference pattern. Our novel magnetic approach to the tip exchange yields a 99% success rate, higher than the traditional vacuum techniques.

 

Automatic Wafer Handler (EFEM or FOUP)

The XE-3DM can be further customized by adding an automatic wafer handler (EFEM or FOUP or other). The high-precision, nondestructive wafer handler robot arm fully ensures XE-3DM users to receive fast and reliable wafer measurement automation.

 

Ionization System

Ionization system effectively removes electrostatic charges. It ionizes the charged objects and is very reliable since the system always generates and maintains an ideal balance of positive and negative ions without causing any contamination to the surrounding area. It also reduces the accidental electrostatic built-in charge that may occur during sample handling.

Park 3DM Series - Specifications | Park Atomic Force Microscope