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Park NX-Wafer Specifications

System
Specification

Motorized XY stage

200mm : travels up to 275 mm × 200 mm, 0.5 µm resolution

300mm : travels up to 400 mm × 300 mm, 0.5 µm resolution, 1 µm repeatability


Motorized Z stage

25 mm Z travel distance,
0.08 µm resolution, < 1 µm repeatability

Motorized Focus Stage

9 mm Z travel distance for on-axis optics


Sample Thickness Allowance

up to 20 mm


Full scan range Z run-out

< 2 nm, repeatability < 1nm


COGNEX Pattern Recognition

pattern align resolution of 1/4 pixel

 

Scanner Performances

XY Scanner

100 µm × 100 µm (Large mode)
50 µm × 50 µm (Medium mode)
10 µm × 10 µm (Small mode)
Single-module flexure XY scanner with closed-loop control


XY Scanner Resolution

0.15 nm (Large mode)

Z Scanner Range

15 µm (Large mode)
2 µm (Small mode)

Z Scanner Resolution

0.016 nm (Large mode)
0.002 nm (Small mode)

Z Scanner Detector Noise

0.02 nm @ 1kHz

 

AFM and XY Stage
Control Electronics

ADC

18 channels
4 high-speed ADC channels
24-bit ADCs for X,Y and Z scanner position sensor

 

DAC

12 channels
2 high-speed DAC channels
20-bit DACs for X,Y and Z scanner positioning

 

Compliances

CE

SEMI Standard S2/S8

 

Vibration, Acoustic Noise, and ESD Performances

Floor Vibration

< 0.5 µm/s (10 Hz to 200 Hz w/ Active Vibration Isolation System)

Acoustic Noise

>20 dB attenuation w/ Acoustic Enclosure

 

Facility Requirements

Room Temperature (Stand By)

10 °C ~ 40 °C 


Room Temperature (Operating)

18 °C ~ 24 °C


Humidity

30% to 60% (not condensing)


Floor Vibration Level

VC-E (3 µm/sec)


Acoustic Noise

Below 65 dB

Pneumatics

Vacuum : -80 kPa
CDA (or N2): 0.7 MPa


Power Supply Rating

208V - 240 V, single phase, 15 A (max)


Total Power Consumption

2 KW (typical)


Ground Resistance

Below 100 ohms

 

Dimensions & Weight

200 mm System

2732 mm(w) × 1100 mm(d) x 2400 mm(h)
w/ EFEM, 2110 kg approx. (incl. Control Cabinet)


Ceiling Height

2000 mm or more


Operator Working Space

3300 mm (w) x 1950 mm (d), Minimum

300 mm System

3486 mm(w) × 1450 mm(d) x 2400 mm(h)
w/ EFEM, 2950 kg approx. (incl. Control Cabinet)


Ceiling Height

2000 mm or more


Operator Working Space

4770 mm (w) x 3050 mm (d), Minimum

 
footprint-300mm-wafer[ Park NX-Wafer 300mm installation layout ]
 
 

Park XE-Wafer Specifications

SPECIFICATIONS

System Specification

200 mm Motorized XY stage : travels up to 275 mm × 200 mm, 0.5 μm resolution
300 mm Motorized XY stage : travels up to ~375 mm × 300 mm, 0.5 μm resolution, < 1 μm repeatability
Motorized Z stage : ~30 mm Z travel distance, ~0.08 μm resolution, < 1 μm repeatability
Motorized Focus Stage : 11 mm Z travel distance for on-axis optics
Sample Thickness Allowance : up to 20 mm
Full scan range Z run-out : < 2 nm, repeatability < 1 nm
COGNEX Pattern Recognition : pattern align resolution of 1/4 pixel

 

Scanner Performances

XY Scanner Range : 100 μm × 100 μm (large mode), 50 μm x 50 μm (medium mode), 10 μm × 10 μm (small mode)
XY Scanner Resolution : 1.5 nm (high voltage mode), < 0.2 nm (low voltage mode)
Z Scanner Range : 12 μm (high voltage mode), 1.7 μm (low voltage mode)
Z Scanner Resolution : < 0.2 nm

 

AFM and XY Stage Control Electronics

Controller Processing Unit : 600 MHz and 4800 MIPS
Signal ADC &DAC : 16-bit, 500 kHz bandwidth, internal lock-in

 

Vibration, Acoustic Noise, and ESD Performances

Floor Vibration : < 0.5 μm/s (10 Hz to 200 Hz w/ Active Vibration Isolation System)
Acoustic Noise : > 20 dB attenuation w/ Acoustic Enclosure

 

Facility Requirements

Room Temperature (Stand By) : 10 °C ~ 40 °C
Room Temperature (Operating) : 18 °C ~ 24 °C
Humidity : 30% to 60% (not condensing)
Floor Vibration Level : VC-E (3 μm/sec)
Acoustic Noise : Below 65 dB
Pneumatics: Vacuum : -80 kPa
CDA : 0.7 Mpa
Power Supply Rating : 208~240V, single phase, 15A (max)
Total Power Consumption : 2 KW (typical)
Ground Resistance : Below 100 ohms

 

Dimension & Weight

200mm System : 880 mm(w) × 1050 mm(d) × 2024 mm(h) w/o EFEM, 800 kg approx. (incl. XE-WAFER main body)
                                1820 mm(w) × 1050 mm(d) × 2024 mm(h) w/ EFEM, 1010 kg approx. (incl. XE-WAFER main body)
Control Cabinet : 800 mm(w) × 800 mm(d) × 1000 mm(h), 160 kg approx. (incl. controllers)
                                600 mm(w) x 800 mm(d) x 2000 mm(h) tower type, 220 kg approx. (incl. controllers)
System Floor Space : 1780 mm(w) × 980 mm(d) w/o EFEM
System Floor Space : 3050 mm(w) × 980 mm(d) w/ EFEM
Ceiling Height : 2000 mm or more
Operator Working Space : 3300 mm(w) x 1950 mm(d), minimum

300mm System : 1220 mm(w) × 1200 mm(d) × 2024 mm(h) w/o EFEM, 1150 kg approx. (incl. XE-WAFER main body)
                                2490 mm(w) × 1720 mm(d) × 2024 mm(h) w/ EFEM, 1450 kg approx. (incl. XE-WAFER main body)
Control Cabinet : 800 mm(w) × 800 mm(d) × 1000 mm(h), 160 kg approx. (incl. controllers)
                                600 mm(w) x 800 mm(d) x 2000 mm(h) tower type, 220 kg approx. (incl. controllers)
Wafer Handler (EFEM) : 1270 mm(w) x 1720 mm(d) x 2024 mm(h), 300 kg approx
System Floor Space : 1220 mm(w) × 1200 mm(d) w/o EFEM
System Floor Space : 2490 mm(w) × 1720 mm(d) w/ EFEM
Ceiling Height : 2000 mm or more
Operator Working Space : 4500 mm(w) x 3120 mm(d)

footprint[ Park XE-Wafer 200mm installation layout ]
 

Software & User Interface

XEA - Industrial Automation & Analysis

XEA is a system software for automation that carries out the AFM measurement of a sample following the preset procedure written in a recipe file. User-friendly XEA architecture provides flexibility to operator to perform various system-wide functions.
 
• Supports auto, semi-auto, and manual mode
• Editable measurement method for each automated procedure
• Live monitoring of the measurement process
• Automatic analysis of acquired measurement data

 

XEP – Data Acquisition

All the user controls on AFM measurements are operated through XEP, the data acquisition program. The user-oriented interface provides easy operation of AFM.
 
• Simultaneous data acquisition of up to 16 images
• Maximum 4096 × 4096 pixels image size
• Dedicated Force-distance and I-V spectroscopy with batch processing
• Cantilever spring constant calibration
• Script-level control through external program (LabVIEW, C++)

 

XEI – Image Processing and Analysis

XEI is the AFM image processing and analysis program. The powerful processing algorithms make the analysis easy and streamlined. With its most advanced and versatile imaging features, XE users can obtain essential and critical information from their experiment.
 
• Image analysis of line profile, region, 3D rendering
• Spectroscopy data analysis module (F-d, I-V)
• Directly copy/paste to presentation program
• Multiple image comparison
• Image overlay of two different images

 

Options

Long Range Profiler

Less than ±5 nm out-of-plane motion over 10 mm scan.

 

Automatic Tip Exchange (ATX)

Automatic Tip Exchange performs fully automated tip exchanges in order to seamlessly continue automated measurement routines. It automatically calibrates cantilever location and optimizes measurement settings based on measurements of a reference pattern. Our novel magnetic approach to the tip exchange yields a 99% success rate, higher than the traditional vacuum techniques.

 

Automatic Wafer Handler (EFEM or FOUP)

The XE-3DM can be further customized by adding an automatic wafer handler (EFEM or FOUP or other). The high-precision, nondestructive wafer handler robot arm fully ensures XE-3DM users to receive fast and reliable wafer measurement automation.

 

Ionization System

Ionization system effectively removes electrostatic charges. It ionizes the charged objects and is very reliable since the system always generates and maintains an ideal balance of positive and negative ions without causing any contamination to the surrounding area. It also reduces the accidental electrostatic built-in charge that may occur during sample handling.

 

Productivity meets Accuracy

Automatic Tip Exchange (ATX)

The ATX automatically locates tips by pattern recognition and uses a novel magnetic approach to disengage a used tip and pick up a new tip, with an incredible 99.9% success rate. The laser spot is then automatically optimized along the X- and Y-axis by motorized positioning knobs.

Automatic-Tip-Exchange

Ionization System for a more stable scanning environment

Our innovative ionization system quickly and effectively removes electrostatic charges in your sample's environment. Since the system always generates and maintains the ideal balance of positive and negative ions, it can create an extremely stable charge environment with little contamination of the surrounding area and minimal risk of accidental electrostatic charge during sample handling.

NX-HDM Ionization-System

Automatic Wafer Handler (EFEM or FOUP)

The NX-WAFER can be configured for various automatic wafer handlers (EFEM or FOUP or other). The high-precision, nondestructive wafer handler robot arm fully ensures users always get fast and reliable wafer measurements.

 

Automatic-Wafer-Handler
 

High productivity and powerful features for inline wafer-fab metrology

Automatic Defect Review for Bare Wafers and Substrates

The new 300mm bare wafer ADR provides a fully automated defect review process from transfer and alignment of defect maps to the survey and zoom-in scan imaging of defects that uses a unique remapping process that does not require any reference marker on a sample wafer. Unlike SEM which leaves square-shaped destructive irradiation marks on defect sites after its run, . the AFM-based defect review enables non-destructive 3D imaging of defects as small as a few nanometers. The linkage between a defect inspection tool and the AFM is carried out by advanced coordinate translation with enhanced vision technique. Since it is fully automated, it does not require any separate steps to calibrate the stage of the targeted defect inspection system, increasing throughput by up to 1,000%.

  Read More related application

BareWaferADR


Automatic Transfer and Alignment of Defect Maps with Enhanced Vision

By utilizing Park's proprietary coordinate translation technique, the new Park ADR AFM can accurately transfer the defect maps obtained from a laser-scattering defect inspection tool to a 300mm Park AFM system. This technology does not require any separate step to calibrate the stage of the targeted defect inspection system and allows full automation for high throughput defect imaging.

BareWaferADR-3-

 


Automated Search & Zoom-in Scan

BareWaferADR-6

The defects are imaged in two steps;(1) a survey imaging, either by AFM or enhanced optical vision, to refine the defect location, then (2) a zoom-in AFM scan to obtain a detailed image of the defect, presenting automatic analysis of the defect type and the subsequent defect dimensions. .


Long Range Profiling for CMP Characterization

Planarization is the most important step in the back-end processes where metals and dielectric materials are used. Both local and global uniformity after chemical mechanical polishing (CMP) affect the yield of chip manufacturing significantly. Accurate CMP profiling is a critical metrology necessary to optimize process conditions for best planarity and improve production yield.

Combining Park NX-Wafer with a sliding stage provides a long range profiling capability for CMP metrology. Due to the unique scanner design of Park's automated AFM, the combined system provides very flat profiling and there is no need for complex background subtraction or calibration after each measurement. The Park NX-Wafer enables unprecedented CMP metrology of both local and global planarity measurements including dishing, erosion, and edge-over-erosion (EOE).


Sub-Angstrom Surface Roughness Control

Semiconductor suppliers are developing ultra-flat wafers to address the ever-increasing need for shrinking device dimensions. However, there has never been a metrology tool capable of providing accurate and reliable measurements for the sub-Angstrom roughness of these substrate surfaces. By delivering the industry's lowest noise floor of less than 0.5 Å throughout the wafer area, and combining it with True Non-Contact Mode™, the Park NX-Wafer can make accurate, repeatable, and reproducible sub-Angstrom roughness measurements for the flattest substrates and wafers with minimized tip-to-tip variation. Very accurate and repeatable surface measurements can be obtained even for the long-range waviness measurement of scan sizes up to 100m x 100m.


High-Throughput Wafer-Fab Inspection and Analysis

• Automatic tip exchange with 99.9% success rate and minimum tact time
• Equipment Front End Module (EFEM) for automatic wafer handling
• Cleanroom compatibility and remote control interface
• Automatic data acquisition and analysis of trench width, depth, and angle measurements

 

Park NX-Wafer features

50mm Long Range Profiler

The long range profiler is an essential component of Atomic Force Profilometry (AFP) and comes with a dedicated user interface for the automated CMP profiling and analysis.

• Maximum sliding range: up to 50mm
• Out-of-Plane Motion (OPM): less than ± 10 nm @ 10 mm range
• Max number of data points: up to 1,048,576


100 µm x 100 µm Flexure-Guided XY Scanner with Closed-loop Dual Servo System

The XY scanner consists of symmetrical 2-dimensional flexure and high-force piezoelectric stacks that provide highly orthogonal movement with minimal out-of-plane motion, as well as the high responsiveness essential for precise sample scanning at the nanometer scale. Two symmetric, low-noise position sensors are incorporated on each axis of the XY scanner to retain a high level of scan orthogonality for the largest scan ranges and sample sizes. The secondary sensor corrects and compensates for non-linear and non-planar positional errors caused by a single sensor alone.


15 µm High Speed Z Scanner with Low Noise Position Sensor

The NX-Wafer provides you with unprecedented accuracy in topography height measurement by utilizing its ultra-low noise Z detector instead of the commonly used Z voltage signal that is non-linear in nature. This industry leading low noise Z detector replaces the applied Z voltage as the topography signal. Driven by a high-force piezoelectric stack and guided by a flexure structure, the standard Z scanner has a high resonant frequency of more than 9 kHz (typically 10.5 kHz) and Z-servo speed of more than 48 mm/sec tip velocity enabling more accurate feedback. The maximum Z scan range can be extended from 15μm to 40μm with the optional long range Z scanner.


Automatic Measurement Control so you can get accurate scans with less work

aotomatic-softwareThe NX-Wafer is equipped with automated software that makes operation nearly effortless. Just select the desired measurement program to get precise multi-site analysis with optimized settings for cantilever tuning, scan rate, gain, and set point parameters.

Park's user-friendly software interface gives you the flexibility to create customized operation routines so you can access the full power of the NX-Wafer and get the measurements you need.

Creating new routines is easy. It takes about 10 minutes to make one from scratch, or less than 5 minutes to modify an existing one.


Park NX-Wafer’s automated system features:

• Auto, semi-auto, and manual mode so you have complete control
• Editable measurement method for each automated routine
• Live monitoring of the measurement process
• Automatic analysis of acquired measurement data

 

The only wafer fab AFM with automatic defect review

Fully automated AFM solution for defect imaging and analysis that improves defect review productivity by up to 1,000%

Park's Smart ADR provides fully automated defect review and identification, enabling a critical inline process to classify defect types and source their origin through high resolution 3D imaging.
Designed specifically for the semiconductor industry, Smart ADR is the most advanced defect review solution available, featuring automatic target positioning without the need for labor intensive reference marks that often damage the sample. The Smart ADR process improves productivity by up to 1,000% compared to traditional defect review methods. Additionally, the new ADR capability offers up to 20x longer tip life thanks to Park's groundbreaking True Non-Contact™ Mode AFM technology.

Low noise Atomic Force Profiler for accurate, high throughput CMP profile measurements

The industry leading low noise Park AFM is combined with a long range sliding stage to become an Atomic Force Profiler (AFP) for chemical mechanical polishing (CMP) metrology. The new low noise AFP provides very flat profiling for both local and global uniformity measurements with the best profiling accuracy and repeatability on the market. Unique True Non-Contact™ mode enables nondestructive in-line measurements with much longer tip life, while Park's innovative True Sample Topography™ obtains CMP profiles without the usual artifacts associated with a traditional piezotube-based AFP. This guarantees accurate height measurements with no non-linear or high noise background subtraction over a wide range of profiling lengths.

Sub-Angstrom surface roughness measured with extreme accuracy and minimized tip-to-tip variation

The surface roughness of a wafer is critical in determining the performance of a semiconductor device. For the state-of-the-art device manufacturer, both chip makers and wafer suppliers are demanding more accurate roughness control of ultra-flat surface on Si or SOI wafers. By delivering the industry’s lowest noise floor of less than 0.5 Å and combining it with True Non-Contact™ mode, Park NX-Wafer can reliably acquire sub-Angstrom roughness measurements with minimum tip-to-tip variation. Park's Crosstalk Elimination also allows very flat orthogonal XY scanning with no background curvature, even on the flattest of surfaces regardless of scan location, rate, and size. This enables very accurate and repeatable surface measurement from micro-roughness to long-range waviness.

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