Park Systems AFM, Semiconductor industry, automated AFM solutions, critical dimensions, lithography, wafer inspection, cleaning, photomask

AFM Solutions

AFM Technology

AFM Buyer's Guide

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AFM Solutions

With its ability to accurately measure critical dimensions in the micrometer to nanometer regime, Atomic Force Microscope (AFM) is becoming the tool of choice for applications involving surface roughness, trench depth, and line width characterization of various samples features and materials.

Accuracy Like Never Before

Shrinking form factors are driving the need to design at the nanoscale level in the semiconductor markets. Traditional metrology tools have lacked the accuracy needed for nanoscale design and manufacturing. Park Systems has met this challenge in industrial metrology with enabling breakthroughs.

- Crosstalk Elimination (XE) enables artifact-free and non-destructive imaging
- New 3D AFM enables high resolution imaging of sidewall or undercut features

Throughput Like Never Before

AFMs that have enabled nanoscale design have traditionally not been fast enough for use in production quality control. All that has changed with Park Systems revolutionary gains in throughput enabling AFMs for use in automatic in-line manufacturing.

These include automatic tip exchange where our novel magnetic approach has a 99% success rate, higher than traditional vacuum techniques. Also, full access to raw data and a true partnership with customers are required for any process and throughput optimization.

Cost-Effectiveness Like Never Before

Accuracy and throughput in nanometrology must be delivered in a cost-effective solution to move successfully from research to inline manufacturing. Park Systems have met this cost challenge with industrial AFM solutions that address the need for faster, efficient automation and longer tip life.

We cut costs by replacing slower and expensive SEM with efficient, automatic, and affordable 3D AFM for industrial in-line manufacturing. To pinpoint defects in new designs, manufacturers today need 3D information to characterize trench profiles and sidewall feature variation. Modular AFM platform allows rapid software and hardware changes, enabling cost-effective upgrades and better optimization for the most complex and demanding measurements in production quality control.

Also, we lower the cost of ownership with at least 200% longer AFM tip life. The tapping forces of conventional AFMs cause faster tip wear, but our True Non-Contact Mode^TM AFMs maintain tip quality resulting in the lower total cost of ownership.

FA & QA Solutions for Semiconductor Industry

Park NX20
The leading nano metrology tool for failure analysis and large sample research

Automated AFM Solutions for Semiconductor Industry

Park Systems provides highly reliable solutions for the process development and production monitoring of lithography, wafer inspection, cleaning, and photomask.

XE-Wafer
Wafer-based inspection of surface roughness, trench width, depth, and angle measurements
on wafers in a production environment

XE-3DM
High resolution sidewall characterization including sidewall roughness and imaging, and critical angle measurements
on wafers in a production environment

Target Applications for Semiconductor Metrology

Chemical Mechanical Polishing
New 3D-AFM for High Resolution Sidewall Imaging