AFM Technology
Crosstalk Elimination
True Non-Contact ModeTM
True Sample TopographyTM
Application Notes
References
Atomic Force Microscope

   Application Notes
Biological Science
Application note - Subject Download
Targeted Patch Clamping with Ion Conductance Microscopy new >>
Live Cell Volume Measurement of ICM >>
ICM Image of Suspended Collagen Fibrils >>
Single Strand DNA Molecules >>
DNA Oligonucleotides >>
Embryonic Stem Cell >>
Phase Separation in the Co-Extruded Polymer >>
Mouse Sperm Cells >>
Liposomes and Vesicles >>
Lipid Vesicle and Bilayer >>
Human Astrocytoma Cells >>
AFM and Confocal Microscopy >>

Materials Science
Application note - Subject Download
True Sample Topography Acquired by Low-Noise Z Position Sensor >>
SrTiO3 Surfaces by Using Park Systems XE-70 AFM >>
Nanoscale Surface Photovoltage >>
Cross-section of Polymer Film >>
Zinc Oxide Surfaces >>
AlGaN/GaN HEMT Reliability >>
Hard-tip, Soft-spring Lithography >>
Solar Cells >>
Patterned Arrays of Magnetic Nanostructures >>
Atomic Force Microscopy and Raman Spectroscopy >>
Quantum Dots/Photonic Devices >>
Critical Roughness Metrology >>
Single Crystal Yttrium Iron Garnet (YIG) >>
Nanoparticles/Nanotubes >>
Thin Films Nanolithography (XEL) >>
Graphene (Step Height) >>
Graphene Membrane/Graphite >>
Thin Film - ZnO >>
Characterization of Epitaxially Grown MnAs Films Using AFM and MFM >>
Surface Topography Considerations of Patterned Sapphire Substrates for Blue/Green Light Emitting Diode >>
Production and Measurement of Nanodot Array >>
Atomic Force Microscopy Investigation of 1D Structures Utilizing the XE-series Instruments >>
Polymer Composite >>
Characterization of Organic Photovoltaic Cells >>
Phase Separation in the Co-Extruded Polymer >>
Green Chemical Polymer >>
Surface Morphology of Electrospun Fibers >>

Data Storage
Application note - Subject Download
Surface Roughness Measurement of Media and Substrate new >>
High Throughput and Non-Destructive Sidewall Roughness Measurement Using 3-Dimensional AFM new >>
True Sample Topography Acquired by Low-Noise Z Position Sensor >>
Three-Dimensional Imaging of Undercut and Sidewall Structures by Atomic Force Microscopy >>
Critical Roughness Metrology >>
Undercut Structures and Sidewall Roughness >>
Etched Silicon Structures >>
AFM Metrology Considerations of Hard Disk Manufacturing >>
Programmable Data Density (PDD) for High Throughput Feature Measurement >>
New 3D-AFM for High Resolution Sidewall Imaging >>
Automatic Defect Review AFM for Hard Disk Media and Substrates >>
Patterned Arrays of Magnetic Nanostructures >>

Semiconductors
Application note - Subject Download
Surface Roughness Measurement of Media and Substrate new >>
High Throughput and Non-Destructive Sidewall Roughness Measurement Using 3-Dimensional AFM new >>
True Sample Topography Acquired by Low-Noise Z Position Sensor >>
New 3-Dimensional AFM for CD Measurement and Sidewall Characterization >>
Three-Dimensional Imaging of Undercut and Sidewall Structures by Atomic Force Microscopy >>
New 3D-AFM for High Resolution Sidewall Imaging >>
Etched Silicon Structures >>
Critical Roughness Metrology >>
Solar Cells >>
High Aspect Ratio Structure >>
Critical Dimension Measurement of High Aspect Ratio Trench with XE AFM >>
Chemical Mechanical Polishing (CMP) Metrology with Advanced AFM Surface Profiler >>


Atomic Force Microscope
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