High Resolution Access to Undercut and Sidewall
  • Unique decoupled XY and Z scanning system with tilted Z scanner
  • Z-scanner is tilted sideways from -38 to +38 degrees
  • Use of normal high aspect ratio tips for high resolution imaging
  • XY scan of up to 100 μm x 100 μm
  • Up to 25 um Z scan range by high force scanner

Complete 3D Metrology of Sidewall
  • Sidewall roughness measurement
  • Critical angle measurement of sidewalls
  • Critical dimension measurements of vertical sidewalls

Non-destructive CD and Sidewall Measurements by True Non-Contact Mode^TM
  • In-line measurement of features as small as 45nm
  • Non-destructive measurement of soft photoresist
  • Less tip wear for prolonged high-quality and high-resolution imaging
  • Immunity from parameter-dependent results observed in tapping imaging

High Throughput Inline Automation
  • Automatic data acquisition and analysis of trench, overhang, and undercut Features
  • Cleanroom compatibility and remote control interface
  • Automatic tip exchange (optional)
  • Equipment Front End Module (EFEM) for wafer Handling (optional)

Nanotechnology Solutions Partner
  • Partnering with customers to meet the fast changing requirements
  • Flexible software and hardware modifications to the modular platform
  • Enable rapid response to customers' needs