The XE-3DM provides the unique advantage of a non-destructive in-line imaging tool capable of providing a) high resolution, b) direct, and c) repeatable measurements with complete three dimensional information for lines, trenches, and multilayer 3D devices.

Park Systems provides a reference metrology system for the critical dimension and sidewall analysis. As a fully automated AFM system, the 3DM allows for sidewall, undercut, and line/trench width characterization. With our True Non-Contact Mode⑩, our XE-3DM is capable of imaging the most challenging structures such as soft photoresists and 3D multilayer topologies.

As the dimensions of device structures continue to decrease and newer 3D structures emerge, the methods for critical dimension metrology are no longer adequate to characterize process variables. For the traditional techniques such as CD-SEM, OCD, and FIB/SEM, the limitations are becoming more apparent. For example, due to the sidewall roughness, the CD-SEM does not provide a clear definition at the structure edge, the OCD only provides an average value of the critical dimension, and the FIB/SEM provides only a single point measurement and does not provide a complete picture of the structure dimensions.